Apply For IC Packaging Engineer/Manager

• Tata Electronics
• Office Location
• Full Time

Experience: 5 - 5 years required

Pay:

Salary Information not included

Type: Full Time

Location: Karnataka

Skills: Wire bonding, SMT, OS, packing, NPI, lvm, MES, Automation, Flip Chip packaging engineering, Back grinding, Laser groove, Mechanical sawing, Flip Chip Attach, Mass Reflow, TCB, Fluxless, Flux Cleaning, Plasma Clean, Underfill, Mold Underfill, Ball Attach, Saw Singulation, FVI, Pick, Place, DFM solution, 4Ms, BOM selection