Senior IC Packaging Engineer Randstad India
Randstad India
Office Location
Full Time
Experience: 8 - 8 years required
Pay:
Salary Information not included
Type: Full Time
Location: Karnataka
Skills: Semiconductor Packaging, reliability testing, Assembly Processes, Integrated Circuit IC, Power Management ICs PMIC, Global Quality Standards, collaborating with OSAT, interfacing with packaging teams, Design solutions, Electrical Simulations, Thermal Simulations, mechanical simulations
About Randstad India
Job Description
As a Senior Level Semiconductor Product Engineer specializing in the Power Domain, you will leverage your extensive hands-on experience in semiconductor product engineering and new product development. Your primary focus will be on Power Management ICs (PMIC) and ensuring a proven track record in this area. Your role will require an in-depth understanding of Integrated Circuit (IC) and package qualification, along with expertise in reliability testing to meet stringent qualification requirements. You should be well-versed in global quality standards such as AEC-Q, JEDEC, and IPC, particularly in the context of semiconductor packaging for automotive applications. Collaboration will be key as you work closely with packaging teams to identify optimal packaging and design solutions. Your strong capability in interfacing with various stakeholders, including OSAT (Outsourced Semiconductor Assembly and Test) and subcontractors, will be crucial in ensuring the successful development and qualification of semiconductor products. Responsibilities: - Lead the development and qualification of semiconductor products, with a focus on Power Management ICs. - Collaborate with packaging teams to implement effective packaging and design solutions. - Conduct comprehensive package assessments, including electrical, thermal, and mechanical simulations. - Ensure adherence to global quality standards such as AEC-Q, JEDEC, and IPC. - Partner with OSAT and subcontractors for assembly processes. Requirements: - Extensive hands-on experience in semiconductor product engineering and new product development, with a specific emphasis on Power Management ICs. - Deep understanding of IC and package qualification, reliability testing, and qualification requirements. - Knowledge of semiconductor packaging for automotive applications and familiarity with global quality standards. - Experience in interfacing with packaging teams and conducting package assessments. - Strong communication and teamwork skills. Preferred Qualifications: - Background in electrical, thermal, and mechanical simulations. - Proven ability to work effectively with OSAT and subcontractors. Join our team and utilize your expertise to drive innovation and quality in semiconductor product engineering within the power domain.,