CMP Equipment Manager Tata Electronics
Tata Electronics
Office Location
Full Time
Experience: 5 - 5 years required
Pay:
Salary Information not included
Type: Full Time
Location: Gujarat
Skills: Process control, Troubleshooting, etch, Metrology, Communication, collaboration, Interpersonal Skills, Project Management, CMP Chemical Mechanical Planarization equipment, semiconductor fab processing, tool qualification, CMP process integration, deposition, clean
About Tata Electronics
Job Description
Job Description: Lead and manage the CMP (Chemical Mechanical Planarization) equipment team to ensure tool availability, stability, and execution of planned activities in line with production schedules. Actively coach and develop engineers in both technical capabilities and soft skills. Drive continuous improvement projects focused on equipment performance, reliability, and productivity to meet operational and business objectives. Oversee process stability and control across oxide, metal, and barrier CMP steps, ensuring compliance with company policies, procedures, and industry regulations. Support technology transfer and ramp-up activities for CMP equipment and processes in new fab startups, including cross-site collaboration (e.g., fab in India). Collaborate closely with process integration, yield enhancement, and upstream/downstream module teams (e.g., deposition, metrology) to lead tool qualifications and implement new CMP equipment and technologies. Ensure all CMP equipment and operations comply with quality, environmental, and safety standards. Strong familiarity with semiconductor fab processing and integration flows is essential. Qualifications: Bachelors or Masters degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field. Hands-on experience with CMP tools and systems, including process control, tool qualification, and troubleshooting (e.g., AMAT, Ebara, or TEL CMP platforms). Minimum 5+ years of experience in a wafer fab environment, preferably within a logic semiconductor foundry. Strong understanding of CMP process integration and interaction with upstream and downstream modules (e.g., deposition, etch, clean, and metrology). Excellent communication, collaboration, and interpersonal skills to work effectively with cross-functional teams and equipment vendors. Proven ability to manage multiple priorities, lead projects, and deliver results within tight timelines. Work Model The location would be on-site in Dholera, Gujarat, India with travel overseas as necessary.,